Semiconductor & Electronics
The semiconductor and electronics manufacturing industry represents the pinnacle of precision manufacturing, where nanometer-scale processes demand absolute environmental control and contamination elimination. Advanced chip fabrication facilities operate at technology nodes…
Understanding Your Industry
The semiconductor and electronics manufacturing industry represents the pinnacle of precision manufacturing, where nanometer-scale processes demand absolute environmental control and contamination elimination. Advanced chip fabrication facilities operate at technology nodes below 5nm, requiring ultra-pure vacuum environments and contamination-free compressed air throughout wafer processing, thin film deposition, etching, and lithography operations.
Modern semiconductor fabs invest billions in cleanroom infrastructure operating at ISO Class 1-3 standards, where even molecular-level contamination can destroy entire wafer batches and compromise yield rates. Traditional oil-lubricated vacuum systems pose catastrophic risks to chip manufacturing, as hydrocarbon contamination from oil mist can ruin photoresist layers, contaminate plasma chambers, and damage precision optical equipment used in advanced lithography processes.
The electronics manufacturing sector faces parallel challenges in PCB fabrication, component assembly, and display panel production. Surface mount technology, automated optical inspection, and precision soldering operations all require oil-free compressed air to prevent defects and ensure product reliability. As device miniaturization continues and manufacturing complexity increases, the industry’s demand for contamination-free process gases and vacuum systems has become absolutely non-negotiable.
Key Industry Requirements
Ultra-pure vacuum meeting SEMI S2 and SEMI F47 standards
Particle-free operation below 0.1 micron contamination level
Hydrocarbon elimination to prevent wafer contamination
High vacuum stability for plasma and CVD processes
Corrosion resistance for aggressive chemical environments
Continuous operation with >99.9% uptime reliability
Real-World Applications
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Critical Pain Points
Understanding the challenges that impact your operations
Molecular Contamination
Oil vapor from conventional vacuum pumps creates molecular contamination that deposits on wafer surfaces during critical processes. Even trace hydrocarbon contamination at parts-per-billion levels can compromise device performance, reduce yields, and cause catastrophic failures in advanced chip manufacturing. The cost of contaminated wafers can exceed millions of dollars per incident.
Process Gas Compatibility
Semiconductor processes utilize highly reactive and corrosive gases including fluorine compounds, chlorine, and other aggressive chemicals. Oil-lubricated pumps suffer rapid degradation when exposed to these process gases, leading to frequent failures, costly repairs, and dangerous oil-chemical reactions that create safety hazards.
Cleanroom Contamination
Oil mist and particulate emissions from traditional vacuum systems contaminate cleanroom environments, compromising the ultra-clean conditions essential for semiconductor manufacturing. Airborne oil particles settle on critical surfaces, wafers, and precision equipment, degrading product quality and requiring extensive cleaning protocols that reduce production throughput.
Yield Loss & Downtime
Equipment failures and contamination incidents directly impact wafer yields and fabrication throughput. Each hour of unplanned downtime in a semiconductor fab can cost hundreds of thousands of dollars in lost production. Frequent maintenance requirements for oil-sealed systems create scheduled downtime that further reduces effective manufacturing capacity and facility utilization.
Our Advanced Solution
Engineered specifically for your industry requirements
Shichang’s advanced oil-free screw vacuum systems deliver semiconductor-grade performance through proprietary dry screw technology specifically engineered for ultra-clean manufacturing environments. Our SCRV series anti-corrosive vacuum pumps provide contamination-free operation while withstanding the most aggressive process gases encountered in chip fabrication.
The precision-engineered screw rotors operate with extremely tight clearances, achieving ultimate vacuum levels below 0.5 mbar without any oil contamination. Special corrosion-resistant coatings and materials enable reliable operation with fluorine compounds, chlorine gas, and other reactive chemicals commonly used in etching, cleaning, and deposition processes. Variable frequency drive control optimizes energy consumption across varying process loads, reducing electricity costs by up to 45% compared to conventional systems.
Integrated monitoring systems provide real-time performance data and predictive maintenance alerts, maximizing uptime and preventing unexpected failures. The oil-free design eliminates hydrocarbon emissions, protecting wafer surfaces and maintaining pristine cleanroom conditions. Modular construction enables rapid component replacement during scheduled maintenance windows, minimizing impact on production schedules and maximizing fabrication facility availability.
Key Features & Advantages
Zero Hydrocarbon Contamination
Completely oil-free operation eliminates all hydrocarbon emissions that could contaminate wafer surfaces or cleanroom environments. Molecular-level purity protects critical semiconductor processes and ensures maximum device yields without risk of oil-related defects or performance degradation.
Corrosion-Resistant Design
Advanced protective coatings and corrosion-resistant materials enable reliable pumping of aggressive process gases including fluorine, chlorine, and other reactive chemicals. Specialized seals and components prevent chemical attack, ensuring long service life in harsh semiconductor manufacturing environments.
Ultra-High Vacuum Performance
Precision screw profiles and optimized rotor geometry achieve ultimate vacuum levels below 0.5 mbar, meeting requirements for plasma etching, thin film deposition, ion implantation, and other critical semiconductor processes. Stable vacuum performance ensures consistent process results and maximum reproducibility.
45% Energy Savings
Variable frequency drive technology and efficient screw design reduce power consumption by 45% compared to traditional oil-sealed systems. Smart load-matching automatically adjusts motor speed to process demands, significantly lowering electricity costs in energy-intensive fabrication facilities.
Cleanroom Compatible Design
Ultra-low vibration operation and zero particle generation enable installation directly within Class 1-3 cleanrooms. Compact footprint minimizes valuable cleanroom space consumption while quiet operation maintains optimal working conditions for precision manufacturing processes.
>99.9% Uptime Reliability
Industrial-grade construction and simplified oil-free design deliver exceptional reliability with minimal maintenance requirements. Predictive diagnostics and remote monitoring prevent unexpected failures, ensuring continuous operation and maximizing fabrication facility productivity.
Performance Comparison
Shichang solution vs. conventional alternatives
| Parameter | Traditional | Shichang |
|---|---|---|
| Hydrocarbon Emission | 50+ ppm | 0 ppm |
| Ultimate Vacuum | 1.5 mbar | 0.5 mbar |
| Energy Efficiency | 70% | 95% |
| Chemical Resistance | Poor | Excellent |
| Maintenance Interval | 500 hours | 2000 hours |
| Cleanroom Compatibility | No | Yes |
| Mean Time Between Failures | 8,000 hours | 25,000+ hours |
See Our Solutions In Action
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